UDEP RMSC 3

Mounting board, data technology

UDEP RMSC 3 components are installation boards from the underfloor system range. The boards are bolted into data device carriers and are used to accommodate up to 3 snap-in data jacks made by R&M. The installation boards are made of aluminium with a black coating on one side and have the installation dimensions of E1 19.5 mm and E2 14.9 mm.

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Variants

Article

H

B

Datenjacks

E1

E2

Farbe

G

  • UDEP-RMSC 3
    Einbauplatine,
    46 mm
    75 mm
    3
    19.5 mm
    14.9 mm
    Schwarz
    0.014 kg
    More information

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Downloads

  • Price list Building extension 2025

    Valid from February 1st, 2025, updated version from 27/01/2025.

    PDF, 46 MB

    de en

  • Elektro- und Elektronikgeräte – Informationen von Herstellern für gewerbliche Nutzer

    Erklärung

    PDF, 106 KB

    de
    Download

  • EC Declaration of Conformity for Underfloor systems

    Installation equipment for electric cables and circuits

    PDF, 59 KB

    de en

  • Underfloor Systems - Catalogue

    Catalogue

    PDF, 34 MB

    de en

  • Technical Information Device Sockets and Installation Devices

    Technische Information

    PDF, 14 MB

    de en

Included accessories