UDEP LEX

Mounting board, data technology

UDEP LEX components are installation boards from the underfloor system range. The boards are bolted into data device carriers and are used to accommodate up to 2 p D-Sub 9 connection sockets made by LexCom. The installation boards are made of aluminium with a black coating on one side and have the installation dimensions of E1 17.3 mm and E2 18.2 mm. A LexCom mounting frame must be used to mount the data jacks.

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Variants

Article

H

B

data jacks

E1

E2

colour

W

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Downloads

  • Price list Building extension 2025

    Valid from February 1st, 2025, updated version from 27/01/2025.

    PDF, 46 MB

    de en

  • Brandschutz von elektrischen Leitungsanlagen und Kabelanlagen

    Erklärung

    PDF, 106 KB

    de
    Download

  • DGNB Product Declaration PENTAFLEX®

    Erklärung

    PDF, 59 KB

    de en

  • Underfloor Systems - Catalogue

    Catalogue

    PDF, 34 MB

    de en

  • Technical Information GRIPRIP®

    Technische Information

    PDF, 14 MB

    de en

Included accessories