UDEP COR

Mounting board, data technology

UDEP COR components are installation boards from the underfloor system range. The boards are bolted into data device carriers and are used to accommodate a maximum of 3 LANscape data jacks made by Corning. The installation boards are made of aluminium with a black coating on one side and have the installation dimensions of E1 22.8 mm and E2 18 mm.

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Variants

Article

H

B

data jacks

E1

E2

colour

W

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Downloads

  • Price list Building extension 2025

    Valid from February 1st, 2025, updated version from 27/01/2025.

    PDF, 46 MB

    de en

  • Brandschutz von elektrischen Leitungsanlagen und Kabelanlagen

    Erklärung

    PDF, 106 KB

    de
    Download

  • DGNB Product Declaration PENTAFLEX®

    Erklärung

    PDF, 59 KB

    de en

  • Underfloor Systems - Catalogue

    Catalogue

    PDF, 34 MB

    de en

  • Technical Information GRIPRIP®

    Technische Information

    PDF, 14 MB

    de en

Included accessories