UDEP AMP SL

Mounting board, data technology

UDEP AMP SL components are installation boards from the underfloor system range. The boards are bolted into data device carriers and are used to accommodate up to 3 AMP-TWIST 7AS SL or AMP-TWIST 7AS SL data jacks from TE Connectivity. The installation boards are made of aluminium with a black coating on one side and have the installation dimensions of E1 20.25 mm and E2 14.78 mm.

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Variants

Article

H

B

Datenjacks

E1

E2

Farbe

G

  • UDEP-AMP SL3
    Einbauplatine,
    46 mm
    75 mm
    3
    20.25 mm
    14.78 mm
    Schwarz
    0.014 kg
    More information

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Downloads

  • Price list Building extension 2025

    Valid from February 1st, 2025, updated version from 27/01/2025.

    PDF, 46 MB

    de en

  • Elektro- und Elektronikgeräte – Informationen von Herstellern für gewerbliche Nutzer

    Erklärung

    PDF, 106 KB

    de
    Download

  • EC Declaration of Conformity for Underfloor systems

    Installation equipment for electric cables and circuits

    PDF, 59 KB

    de en

  • Underfloor Systems - Catalogue

    Catalogue

    PDF, 34 MB

    de en

  • Technical Information Device Sockets and Installation Devices

    Technische Information

    PDF, 14 MB

    de en

Included accessories