Art.-Nr. UDEP-AMP 3
Mounting board, data technology
UDEP AMP components are installation boards from the underfloor system range. The boards are bolted into data device carriers and are used to accommodate a maximum of 3 AMP Corning data jacks FutureCom™ S1200 module Cat.7A from TE Connectivity or the TERA® 4-Pair Outlets made by Sieman. The installation boards are made of aluminium with a black coating on one side and have the installation dimensions of E1 19.3 mm and E2 14.6 mm.
H
Höhe
B
Breite
Datenjacks
max. Anzahl installierbarer Datenjacks
E1
Einbaumaß E1
E2
Einbaumaß E2
Farbe
Farbe
G
Gewicht je Lagermengeneinheit
Valid from February 1st, 2025, updated version from 27/01/2025.
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Installation equipment for electric cables and circuits
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Catalogue
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