Art.-Nr. UDEP-AMP 3

adapter board,

Mounting board, data technology

UDEP AMP components are installation boards from the underfloor system range. The boards are bolted into data device carriers and are used to accommodate a maximum of 3 AMP Corning data jacks FutureCom™ S1200 module Cat.7A from TE Connectivity or the TERA® 4-Pair Outlets made by Sieman. The installation boards are made of aluminium with a black coating on one side and have the installation dimensions of E1 19.3 mm and E2 14.6 mm.

Art.-Nr.
UDEP-AMP 3
height
46 mm
width
75 mm
max. Anzahl installierbarer Datenjacks
3
fitting dimension E1
19.3 mm
fitting dimension E2
14.6 mm
color
black
Weight per storage unit
0.014 kg
Get in touch Download datasheet

Variants

Article

H

B

data jacks

E1

E2

colour

W

Tender texts

Ausschreiben.de

Tender text for this product

Open Link
Heinze.de

Tender text for this product

Open Link

Downloads

  • Price list Building extension 2025

    Valid from February 1st, 2025, updated version from 27/01/2025.

    PDF, 46 MB

    de en

  • Elektro- und Elektronikgeräte – Informationen von Herstellern für gewerbliche Nutzer

    Erklärung

    PDF, 106 KB

    de
    Download

  • EG Declaration of Conformity Installation equipment for electric cables and circuits

    Erklärung

    PDF, 59 KB

    de en

  • Underfloor Systems - Catalogue

    Catalogue

    PDF, 34 MB

    de en

  • Technical Information Device Sockets and Installation Devices

    Technische Information

    PDF, 14 MB

    de en

Included accessories