UDEP AMP

Mounting board, data technology

UDEP AMP components are installation boards from the underfloor system range. The boards are bolted into data device carriers and are used to accommodate a maximum of 3 AMP Corning data jacks FutureCom™ S1200 module Cat.7A from TE Connectivity or the TERA® 4-Pair Outlets made by Sieman. The installation boards are made of aluminium with a black coating on one side and have the installation dimensions of E1 19.3 mm and E2 14.6 mm.

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Variants

Article

H

Höhe

B

Breite

Datenjacks

max. Anzahl installierbarer Datenjacks

E1

Einbaumaß E1

E2

Einbaumaß E2

Farbe

Farbe

G

Gewicht je Lagermengeneinheit
  • UDEP-AMP 3
    Einbauplatine,
    46 mm
    75 mm
    3
    19.3 mm
    14.6 mm
    Schwarz
    0.014 kg
    More information

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Downloads

  • Price list Building extension 2025

    Valid from February 1st, 2025, updated version from 27/01/2025.

    PDF, 46 MB

    de en

  • Elektro- und Elektronikgeräte – Informationen von Herstellern für gewerbliche Nutzer

    Erklärung

    PDF, 106 KB

    de
    Download

  • EC Declaration of Conformity for Underfloor systems

    Installation equipment for electric cables and circuits

    PDF, 59 KB

    de en

  • Underfloor Systems - Catalogue

    Catalogue

    PDF, 34 MB

    de en

  • Technical Information Device Sockets and Installation Devices

    Technische Information

    PDF, 14 MB

    de en

Included accessories