Mounting board, data technology
UDEP AMP components are installation boards from the underfloor system range. The boards are bolted into data device carriers and are used to accommodate a maximum of 3 AMP Corning data jacks FutureCom™ S1200 module Cat.7A from TE Connectivity or the TERA® 4-Pair Outlets made by Sieman. The installation boards are made of aluminium with a black coating on one side and have the installation dimensions of E1 19.3 mm and E2 14.6 mm.
H
Höhe
B
Breite
Datenjacks
max. Anzahl installierbarer Datenjacks
E1
Einbaumaß E1
E2
Einbaumaß E2
Farbe
Farbe
G
Gewicht je Lagermengeneinheit
Price list Building extension 2025
Valid from February 1st, 2025, updated version from 27/01/2025.
PDF, 46 MB
Electrical and Electronic Devices – Information from Manufacturers for Commercial Users
Erklärung
PDF, 106 KB
EC Declaration of Conformity for Underfloor systems
Installation equipment for electric cables and circuits
PDF, 59 KB
Underfloor Systems - Catalogue
Catalogue
PDF, 34 MB
Technical Information Device Sockets and Installation Devices
Technische Information
PDF, 14 MB
Anzahl:
Whether apartment blocks, office complexes or industrial plants: as your reliable partner for numerous applications and construction phases, we support you in every project with expert advice and support services. This allows you to concentrate fully on your core business.
