UDEP AMP

Mounting board, data technology

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UDEP AMP components are installation boards from the underfloor system range. The boards are bolted into data device carriers and are used to accommodate a maximum of 3 AMP Corning data jacks FutureCom™ S1200 module Cat.7A from TE Connectivity or the TERA® 4-Pair Outlets made by Sieman. The installation boards are made of aluminium with a black coating on one side and have the installation dimensions of E1 19.3 mm and E2 14.6 mm.

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Variants

Article

H

B

Datenjacks

E1

E2

Farbe

G

  • UDEP-AMP 3
    Einbauplatine,
    46 mm
    75 mm
    3
    19.3 mm
    14.6 mm
    Schwarz
    0.014 kg
    More information

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Downloads

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  • Elektro- und Elektronikgeräte – Informationen von Herstellern für gewerbliche Nutzer

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  • Underfloor Systems - Catalogue

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